Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications, Gebunden
Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications
- Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3
(soweit verfügbar beim Lieferanten)
- Herausgeber:
- Vikrant Bhateja, Zaid Omar, Anumoy Ghosh, Sarika Shrivastava
- Verlag:
- Springer, 11/2025
- Einband:
- Gebunden
- Sprache:
- Englisch
- ISBN-13:
- 9789819672486
- Artikelnummer:
- 12979105
- Umfang:
- 640 Seiten
- Gewicht:
- 1180 g
- Maße:
- 241 x 160 mm
- Stärke:
- 38 mm
- Erscheinungstermin:
- 2.11.2025
- Serie:
- Lecture Notes in Electrical Engineering - Band 1430
- Hinweis
-
Achtung: Artikel ist nicht in deutscher Sprache!
Weitere Ausgaben von Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications |
Preis |
|---|---|
| Buch, Gebunden, Englisch | EUR 328,56* |
Klappentext
The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2024), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India, during 19-20 December 2024. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today's society.
