Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications, Gebunden

Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Buch

Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3

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Aktueller Preis: EUR 328,56

Versandkosten (United States of America): EUR 19,90

Herausgeber:: Vikrant Bhateja, Xin-She Yang, Hai van Pham, Zaid Omar
Verlag:: Springer, 03/2026
Einband:: Gebunden
Sprache:: Englisch
ISBN-13:: 9783032203175
Artikelnummer:: 12674326
Umfang:: 588 Seiten
Gewicht:: 1037 g
Maße:: 241 x 160 mm
Stärke:: 37 mm
Erscheinungstermin:: 27.3.2026
Serie:: Lecture Notes in Electrical Engineering - Band 1599
Hinweis: Achtung: Artikel ist nicht in deutscher Sprache!

Klappentext

This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today's society.